#200578352-2
ule physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.
Description
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
Basic knowledge of substrate manufacturing process, structure, design rules and material property.
Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
Preferred Skills:
Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
Solid understanding of Design Rules Check and Design for Manufacturing.
Additional Requirements
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