#200586754_KR
he earliest stages of new product introduction, engineering builds, ramp up and throughout product lifecycle. You will ensure high quality and high yield, working with module and sensor teams to quickly resolve technical and operational issues and interface between sensor vendors and downstream module integrators. Areas of coverage will be in the wafer processing of logic + pixel wafer, process integration, wafer test, wafer backend, and product engineering analysis. This role will cover image sensors, but occasional support of other semiconductor vendors will be required. Join Product Operations at Apple and help us leave the world better than we found it!
Description
Minimum Qualifications
BS/MS or equivalent experience in Electrical Engineering, Material Engineering, or allied technical subject
5+ Years' experience in image sensor engineering fields (Process Eng, Process integration engineering, or Product engineering)
In-depth understanding of wafer test, yield, wafer fab process integration, wafer packaging, back-end issues
Familiarity with wafer fab quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
Working proficiency of the English, Korean and Japanese languages
Preferred Qualifications
10+ years proven experience in image sensor devices/systems
Solid understanding of image sensor technology, performance metrics, sensor usage, test, and integration into module and camera system is preferred
Experience with external vendor, supplier, or foundry management
Interpersonal skills of leadership, project management, communication, collaboration, influencing and negotiation
Strong technical skills, involving problem solving and issue root causing in a pressured environment
Proficiency in Japanese Language is a strong plus
Flexibility for domestic travel + International Travel (to Japan, 30%). Evening and weekends work will be needed
Additional Requirements
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