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-scale computer capable of complex, error-corrected computations and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.
In the device packaging group, we build custom packaging technologies for quantum processors, amplifiers, and other devices. Our work includes research on quantum processor performance and qubit environment, design of novel packages and test articles, investigation of new technologies, and hardening of current technologies for deployment. Every Google Quantum AI processor comes through our lab for packaging before its deployment to the fleet.
In this role, you will work with hardware engineers to assemble and test in-house processors and other cryogenic hardware. You will ensure that our next generation of packaging matures quickly and efficiently by recording and processing test data. You will build scalable and reliable electronics for the next level of computing.
The US base salary range for this full-time position is $81,000-$119,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google .
Responsibilities
Collaborate with engineering to mature assembly, test, and manage workflows for new electronics packages and test setups.
Collect electrical and microwave performance data on experimental devices.
Perform electrical performance data processing and physical measurements for engineering review.