Process Integration Engineer

s ranging from few millimeter dies to 100mm wafers.
Wafer- and die-level inspection using a variety of inspection and metrology tools such as optical microscope, SEM, profilometer, AFM, etc.
Safely and consistently operate high accuracy semiconductor bonding tools.
Collect and organize process data, perform data analysis and present weekly summary to the team.
Clear daily communication with the project lead and the team

Required Skills:
Hands-on semiconductor wafer processing experience with silicon and/or III-V substrates. This requires sufficient knowledge of microfabrication processing steps such as photolithography, thin film deposition, dry etch, etc.
CAD and mask layout, competent in general physics as well as basic knowledge of electronic circuit theory, experience with operating high precision die bonder or similar, enthusiastic about reading and understanding scientific/engineering journals for application to assigned job duties.

Required Education:
Education: BS (minimum) or MS degree in an engineering field (electrical, mechanical, chemical or material science)
Experience: 1-3 years of microfabrication cleanroom experience

Special Requirements:
Must be a US citizen (no dual citizenship), and be willing to obtain security clearance (secret or top secret)

Compensation:
The base salary range for this full-time position $76,530 - $93,320 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.