Research Hardware Developer

IBM

4

(720)

Albany, NY

Why you should apply for a job to IBM:

  • 4.4/5 in supportive management
  • 83% say women are treated fairly and equally to men
  • 80% would recommend this company to other women
  • 91% say the CEO supports gender diversity
  • Ratings are based on anonymous reviews by Fairygodboss members.

    #710382BR

    Position summary

    Required Technical and Professional Expertise

    1. Experience with flip chip underfill/molding process
    2. Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)
    3. Basic understanding of packaging/assembly processes, material, laminate, and tools
    4. Ability to debug errors and solve problems
    5. Ability to work in a team environment
      Required Education: master degree
      Preferred Education: Ph.D.

    Preferred Technical and Professional Expertise

      1. Hands-on experience in semiconductor packaging technology
      2. Experience in flip chip assembly process, laminate technology,
        packaging reliability test, failure analysis, and semiconductor process.
      3. Experience with/ design of experiments, process controls, and statistical data analysis.
        Required Education: master degree
        Preferred Education: Ph.D.

    Why you should apply for a job to IBM:

  • 4.4/5 in supportive management
  • 83% say women are treated fairly and equally to men
  • 80% would recommend this company to other women
  • 91% say the CEO supports gender diversity
  • Ratings are based on anonymous reviews by Fairygodboss members.