Principal Microelectronic Packaging Mechanical Design Engineer / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Northrop Grumman

3.2

(26)

Baltimore, MD

Why you should apply for a job to Northrop Grumman:

  • 93% say the CEO supports gender diversity
  • Ratings are based on anonymous reviews by Fairygodboss members.
  • Back-up Care Advantage offers employees a safety net for those days when regular care arrangements fall through.
  • Sitter City offers access to babysitters, dog walkers & caregivers who can assist with special needs, companion care, housekeeping & more.
  • We’ve partnered with College Coach, an organization that can assist employees and their families through important educational challenges.
  • #R10137494

    Position summary

    nior Principal** Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.

    Overview:
    You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website: https://https://www.northropgrumman.com/what-we-do/air/active-electronically-scanned-array-aesa-radars/

    As an integral part of the Engineering and Sciences team, you will be responsible for t he design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems.

    This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.

    Roles and Responsibilities include:

    • Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
    • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
    • Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
    • Providing technical leadership and mentoring to less experienced personnel.

    Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:

    • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
    • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
    • Experience with microelectronic packaging design, including chip-scale packaging technologies and substratePWB layout
    • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
    • Proficient with AutoCAD
    • Familiarity with NX or other 3D modeling software

    Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:

    • Bachelor's degree with 9 years of experience, a Master's degree with 7 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
    • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
    • Experience with microelectronic packaging design, including chip-scale packaging technologies and substratePWB layout
    • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
    • Proficient with AutoCAD
    • Familiarity with NX or other 3D modeling software

    Preferred Qualifications:

    • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
    • Active DoD Secret Clearance or higher
    • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
    • Familiarity with thermal and structural analysis considerations, methodologies, and software tools
    • Experience with hands-on assembly and testing of prototype electronic hardware
    • Experience in a technical leadership role on a cross-functional product development team

    This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher.

    As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:

    • Medical, Dental & Vision coverage
    • 401k
    • Educational Assistance
    • Life Insurance
    • Employee Assistance Programs & Work/Life Solutions
    • Paid Time Off
    • Health & Wellness Resources
    • Employee Discounts

    Link to Benefits: https://totalrewards.northropgrumman.com/

    This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.

    Salary Range: $93,000 - $139,600
    Salary Range 2: $115,400 - $173,200

    The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

    Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
    The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

    Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://https://www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.

    Why you should apply for a job to Northrop Grumman:

  • 93% say the CEO supports gender diversity
  • Ratings are based on anonymous reviews by Fairygodboss members.
  • Back-up Care Advantage offers employees a safety net for those days when regular care arrangements fall through.
  • Sitter City offers access to babysitters, dog walkers & caregivers who can assist with special needs, companion care, housekeeping & more.
  • We’ve partnered with College Coach, an organization that can assist employees and their families through important educational challenges.