Principal / Senior Principal Digital Subsystems Engineer

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is searching for Digital Subsystems Engineers that are ready to use their knowledge of advanced digital technologies and engineering experience to help develop deployable solutions for our customers. This position will be filled at the Principal Engineer or Senior Principal Engineer level based on experience and qualification.

This technology development position that will span multiple roles:

• Team Member - Working with interdisciplinary teams to develop digital electronic subsystems and allocating functionality to subsystem components.
• Leader - Providing direction and oversight to internal and external design teams developing processor subsystem modules and components such as Custom Chassis, Backplanes, Single Board Computers, Multi-chip Modules, SiPs, SoCs, ASICs, and FPGAs
• Innovator - Designing and modeling specific aspects of advanced digital subsystems
• Developer - Developing subsystem architectures and designs that are compatible with company and industry standards

Responsibilities will include:

• Working with engineer leadership and development teams to define subsystem designs to meet system requirements
• Modeling and analyzing critical parameters of subsystem (e.g. power, throughput, cooling, storage, boot, IO latency and bottlenecks)
• Creating subsystem requirement specifications and design during development process
• Performing integration and test activities for subsystems and modules
• Collaborating with design and implementation teams to ensure requirements are met on schedule and within budget
• Learning, applying and driving improvement of internal engineering processes

This requisition may be filled at either the Principal or Senior Principal Level.

Principal Engineer Basic Qualifications:

• Bachelor's Degree in Electrical Engineering or related STEM field.
• 5+ years of professional experience in related industry (3 with MS, 0 with PhD)
• Development and optimization experience in at least one of the following: Embedded Microprocessors, Microelectronic Modules or Digital Processing Algorithms
• US Citizenship required, with the ability to obtain and maintain a US Security Clearance

Senior Principal Engineer Basic Qualifications:

• Bachelor's Degree in Electrical Engineering or related STEM field.
• 9+ years of professional experience in related industry (7 with MS, 4 with PhD)
• 2+ years of technical leadership experience
• Development and optimization experience in at least one of the following: Embedded Microprocessors, Microelectronic Modules or Digital Processing Algorithms
• US Citizenship required, with the ability to obtain and maintain a US Security Clearance

Preferred Qualifications for both levels:

• MS Degree with at least 3+ years of professional experience in related industry
• ACTIVE US Security Clearance at Secret level or higher
• Experience developing electronic subsystems, circuit boards, ASICs and/or FPGAs for aerospace and defense applications
• Demonstrated expertise in field (e.g. journal published, patents)
• Additional Domain knowledge and experience in some of the following or similar areas: Processing, RF Sensors such as Radar, Communications, Digital Receivers, Direct Digital Waveform Generation, Software Defined Radio, EA/ESM systems, EO/IR Sensors, Sonar and Acoustic Sensors, AI & ML, Multi-chip Modules, System in a Package, Hardware Emulation, Digital Twins, High Speed Interfaces or Embedded Networking

Salary Range: $106,500 USD - $159,700 USD
Salary Range 2: $132,100 USD - $198,100 USD

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/ .

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.