determining the soldering compounds and chemicals needed for variety of soldering and chip reflow process
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Understanding and determining solutions for package and board warpages, solder shorts and related problems that occur on high density boards and large packages.
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board rework, blue wire modification,
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Soldering test points on boards, mounting / soldering probe tips as required from the engineering team.
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Mechanical and thermal Assembly which includes assembling heatsinks, test systems, boards on test platforms
What we need to see:
- ITI Electronics or similar with minimum 4 years of experience in semiconductor industry
- Experience in working on rework stations for BGA attaches.
- Multi-layer PCB assembly and handling skills
- Hand soldering Experience: - Discrete Components of different size, Package 1206, 0805, 0603,0402 and 0201
- Fine pitch soldering and rework [0.5mm & QFN], QFP, SOIC
- Fine pitch IC's wiring
- Inspection of boards for improper soldering, damages
- Preparation of different types of cables, Cable crimping, soldering
- Knowledge about mechanical assembly and conformal coating
- Using of different rework equipment, tools - hot air gun, crimping tool, soldering iron
- Knowledge about reading schematics and allegro.
- Basic knowledge about different parts of a Personal computer, computer assembly.