Lab Rework Technician

NVIDIA

2.7

(9)

Bengaluru, India

#JR1990914

Position summary

determining the soldering compounds and chemicals needed for variety of soldering and chip reflow process

  • Understanding and determining solutions for package and board warpages, solder shorts and related problems that occur on high density boards and large packages.

  • board rework, blue wire modification,

  • Soldering test points on boards, mounting / soldering probe tips as required from the engineering team.

  • Mechanical and thermal Assembly which includes assembling heatsinks, test systems, boards on test platforms

What we need to see:

  • ITI Electronics or similar with minimum 4 years of experience in semiconductor industry
  • Experience in working on rework stations for BGA attaches.
  • Multi-layer PCB assembly and handling skills
  • Hand soldering Experience: - Discrete Components of different size, Package 1206, 0805, 0603,0402 and 0201
  • Fine pitch soldering and rework [0.5mm & QFN], QFP, SOIC
  • Fine pitch IC's wiring
  • Inspection of boards for improper soldering, damages
  • Preparation of different types of cables, Cable crimping, soldering
  • Knowledge about mechanical assembly and conformal coating
  • Using of different rework equipment, tools - hot air gun, crimping tool, soldering iron
  • Knowledge about reading schematics and allegro.
  • Basic knowledge about different parts of a Personal computer, computer assembly.