Senior Package Layout Engineer - Hardware

t incorporating system level trade-offs of pins assignment.

• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.

• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.

• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.

• Develop symbols and CAD library databases using Cadence APD design tools

• Develop methodologies to improve layout productivity

What we need to see:

• Hold a B.S. Electrical Engineering or equivalent experience

• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus

• Proven experience in substrate layout of wire bond and flip chip packages, preferred

• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)

• Your validated working knowledge of high-speed design signal integrity practices

• Experience using Valor is helpful

The base salary range is 128,000 USD - 247,250 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

You will also be eligible for equity and benefits. NVIDIA accepts applications on an ongoing basis.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.