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The Packaging Engineer is part of the Electronics Hardware team and is responsible for the mechanical design aspects of power and control electronic products used in locomotives and surface mining trucks. The engineer works with a cross-functional team to integrate complex circuit card assemblies, discrete components, and interconnect devices into a mechanical enclosure design that meets the challenging physical, performance, thermal, and environmental requirements of the project.
Work closely with the electrical and system engineers to design and model complex electronic assemblies involving the integration of PCBs and interconnects with a mechanical enclosure and parts.
Design electronic enclosures and optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
Research/select connector and interconnect devices based on project requirements and vendor options.
Apply industry best practices for ruggedized electronics, including but not limited to thermal management, EMC, shock and vibration.
Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions. Conduct thermal mitigation tradeoff studies, often involving active and/or forced air cooling.
Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack ups, and GD&T.
Prepare and release design documentation (e.g. drawings, calculations, bills of material, and purchase specifications).
Conduct technical design reviews with internal and external customers
Support the organization with vendor selection, production launch and PPAP documentation.
Lead and execute the validation and qualification of new products, components, and assemblies, with focus on mechanical and thermal performance, and electrical functional tests.
Support multiple work assignments with shifting priorities and quickly pivot design direction as new information arises.
Bachelor of Science in Mechanical Engineering or related engineering field.
10+ years of experience designing mechanical packaging for electronic control and power supply assemblies.
Proficient in the use of 3D CAD software (preferably Siemens NX CAD / Unigraphics).
Proficient in simulation tools to perform stress and thermal analyses of electronic assemblies (e.g. ANSYS, Icepak, CFD).
Experience with the integration of rigid, flexible and rigi-flex printed circuit boards into mechanical assemblies.
Familiar with electrical connectors and interconnect methodologies.
Ability to travel 10% of the time.
Master's degree in Mechanical Engineering degree.
Familiar with EMC design best practices with knowledge of grounding/shielding
Solid understanding of material properties, sheet metal applications and welding methodologies.
Experience launching electronic products into production, including knowledge of Design for Manufacturing (DFM), Design for Test (DFT) and Design to Cost (DTC).
Familiar with packaging design considerations in high voltage power supplies and large equipment inverter arrangements.
Experience with active and passive cooling techniques for electronics thermal management.
Wabtec Corporation is committed to taking on the world's toughest challenges. In order to fulfill that commitment we rely on a culture of leadership, diversity and inclusiveness. We aim to employ the world's brightest minds to help us create a limitless source of ideas and opportunities. We believe in hiring talented people of varied backgrounds, experiences and styles...people like you! Wabtec Corporation is committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or expression, or protected Veteran status. If you have a disability or special need that requires accommodation, please let us know.