#R53639
) understand the design specifications and challenges in customer's advanced package designs, 2) work with the internal R&D and field engineer teams to develop and validate new Integrity 3D-IC-based design flows for seamless 3D IC integration, and 3) provide the R&D teams with the customer feedback, competitive threats/opportunities, and other general field intelligence on 3D IC designs in order to align the product development direction with customers' technical needs.
1) Minimum Qualifications
BS in Electrical Engineering, Computer Engineering, Computer Science, or a closely related field.
9+ years of hands-on experience in ASIC digital implementation or relevant fields.
In-depth understanding of the latest EDA tools for physical design.
Excellent interpersonal and team communication skills.
Strong analytical and problem-solving skills.
Knowledge on script languages (Tcl, Perl, Python, or similar).
Ability to fluently speak and write in English.
2) Preferred Qualifications
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