Strategic Student Program: Advanced Packaging Flow Development Intern (EDAGS, Summer 24)

to practice. At Siemens, our goal is to empower our students to become the next leaders of our company.

Baseline Requirements:

• Currently enrolled as a university student - Junior or Senior, or Graduate program

• Minimum 3.0 GPA

• Authorized to work in the United States without the need for current or future sponsorship by the company

• Full-time Hybrid: Cary, NC or Raleigh, NC

Perks:

• Paid volunteer time off

• Employee discounts at our top customer sites

• Networking with our global leaders

• Mentorship from senior engineers

• Individual career development planning

• Professional and technical workshops

• Energetic student community

• Leadership opportunities

• Potential for full time offers after university graduation and completion of the program

Advanced Packaging Flow Development Intern

EDA Global Sales

Siemens EDA, a leader in the Electronic Design Automation (EDA) industry, is seeking a self-starting, motivated, and high performing individual for a paid internship opportunity working with our IC Packaging Applications Engineering team on 2.5D and 3D IC applications. The position is expected to require 15-20 hours per week during school with the possibility of full-time employment during semester breaks.

The primary responsibility for this position will be to develop flows and scripts and/or solutions to automate manual tasks and interface various tools with one another. This position also will also involve flow testing and documentation in the form of application notes.

This position is based in Siemens EDA's Cary, North Carolina office and will require weekly in person interaction with the local team. The need to travel is not anticipated.

Key Responsibilities:

• Collaborate on the creation of EDA tool workflows to facilitate cross-platform design for advanced packaging 3D-IC solutions.

• Apply strong software and scripting skills to manipulate different data formats, ensuring smooth data and information flow between various design tools in the development workflow.

• Work closely with a seasoned Field Application Engineering team, benefitting from their extensive experience in advanced packaging and EDA tool development.

• Engage in a dynamic learning environment, gaining hands-on experience in cutting-edge technologies related to advanced packaging and semiconductor design.

• Work under the guidance of an experienced field application engineering team

• Contribute to cutting-edge technology solutions

Qualifications:

• Rising Junior or above working toward a BS or MS in Electrical/Computer Engineering or Computer Science and residing in the Raleigh-Durham area

• Working knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desirable.

• Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus. Some proficiency with scripting / programming is required, it is a key component of the position.

• Working OS knowledge of Windows and Linux

• Experience with utilities such as Make and Environment Modules is a plus

• Some level of classwork or background with one or more of the following areas related to EDA:

• 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)

• ASIC design methodology from RTL Synthesis to Physical Implementation phases

• Siemens Calibre DRC, LVS, and/or 3DSTACK solutions

• Other EDA solutions such as: Ansys HFSS, Redhawk, Cadence Voltus, or Synopsys PrimeTime

• Package Design (Cadence APD/SiP, Siemens (Mentor) Xpedition)

• Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (Fusion Compiler, IC Compiler, 3DIC Compiler, Custom Compiler) and Cadence (SoC Encounter, Innovus, Virtuoso).

• Working competency with Microsoft Word, Excel, and PowerPoint.

The ideal candidate will:

• Have solid problem solving and reasoning skills;

• Possess a passion to learn and perform at the cutting edge of technology;

• Have a desire to broaden exposure to the business aspects of the technical design world;

• Enjoy contributing to the success of a great team;

• Enjoy helping and motivating others to be successful.

• Have the capability to work independently with minimal direction and supervision.

#LI-EDA #LI-Hybrid #SSP

We are Siemens

A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow! We offer a comprehensive reward package which includes a competitive basic salary, bonus scheme, generous holiday allowance, pension, and private healthcare.

Siemens Software. Transform the every day

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Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.

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We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.

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