2026 Summer Intern Program : Process Support Engineer ( 製程工程師_半導體事業群 )

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台灣應用材料暑期實習專案

**申請資格：大學就學三年以上的在學學生（含碩、博士）；應屆畢業生即將進入職場者請勿投遞；若需繼續升學者請附上入學證明。

**申請文件 : 提供中英文履歷; 中文自傳(同步提供英文版更加分); 學校成績單; 專業認證證照或作品集。

**收件期間 : 2026/2/1 - 2026/4/15 (面試若符合資格，優先給予錄取通知)。

**附加條件：

1. 實習期間：2026/7/1-2026/8/31。

2. 實習期間之交通與住宿需自理。

3. 實習期間，須全程參與，若無法承諾及配合，請勿投遞。

4. 實習尾聲，須提交報告，分享實習成果，方可領取結業證書。並正式納入公司人才庫。

5. 工作待遇：大學生月薪台幣42,000元，碩士生月薪台幣48,000元，博士生月薪台幣53,000元。

Key Responsibilities

1. Experience in Applied Taiwan Semiconductor Product Group

2. Overview of Semiconductor Industry : Study worldwide semiconductor equipment companies and biggest semiconductor foundry company

3. Thin film experiments at Display R&D Lab 4. Semiconductor tool and parts studying at Taiwan Repaired Center and Equipment Product Group) Training

Requirements

Skill: Excellent (listening, speaking, reading and writing) in English. TOEIC > 750,

Knowledge: Well-known semiconductor-related studying

Experience: Semiconductor-related experiment at lab is preferred.

Education (Major/Degree): Major in 3-year university or above, College of Engineering, Science, Electrical Engineering and Computer Science and Semiconductor.

Additional Information

Time Type:
Full time

Employee Type:
Intern / Student

Travel:
Not Specified

Relocation Eligible:
No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.