Metal-Package Process Support Engineer

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As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.

About the Role

We are seeking an experienced Process Support Engineer (PSE) to support Metal-Package semiconductor processes in a customer-facing environment.

This role provides high-visibility technical support at customer sites, working closely with advanced manufacturing teams to enable next-generation semiconductor packaging technologies.

Key Responsibilities

• Provide on-site technical support including system installation, diagnostics, service, and repair of complex semiconductor equipment

• Support customer manufacturing operations by developing and optimizing Metal-Package processes

• Focus on PVD process support, troubleshooting, and process improvement

• Design and execute process experiments and DOE, analyze data using statistical methods, and prepare clear technical reports

• Diagnose and resolve complex process and system issues through structured root cause analysis

• Collaborate closely with customers and internal stakeholders to achieve technical and operational goals

• Apply best practices and existing solutions to deliver practical, innovative process solutions

• Act as a technical resource for junior engineers and support small projects as needed

Minimum Qualifications

• Bachelor's degree in Materials Science, Physics, Electrical/Electronics Engineering, Semiconductor Engineering, or a related field

• 3-7 years of experience in a semiconductor fab or semiconductor equipment environment

• Strong communication and interpersonal skills for customer-facing technical support

• Proficiency in English for technical communication

Preferred Qualifications

• Master's degree or PhD in a related field

• Hands-on experience with PVD

• System experience with Charger systems

• Experience supporting Metal-Package or advanced packaging processes

• Prior customer-facing or on-site support experience

Why Join Us

• Work directly with leading semiconductor manufacturers on advanced packaging technologies

• High-impact, customer-facing role with strong technical ownership

• Opportunity to grow as a subject-matter expert in Metal-Package processes

• Collaborative, technology-driven work environment

Additional Information

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:

Relocation Eligible:
No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.