Packaging Engineer E5

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Location: The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Education: MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent

Technical Expertise: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Skills: Program management, Timeline management, Budget Management, Strong Interpersonnel skills, Leadership, Oral and written communications in English.

Responsibilities:

The successful candidate will be responsible for:

• Program Managing customer engagements in Advanced Packaging, with focus on thermal management, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time.

• Developing new modules leveraging Applied's wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.

• Filing new patentable developments.

• Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and Senior/Managing directors across Applied's business units, including the packaging business unit.

• Helping structure and maintain Applied's roadmap in Packaging modules.

• Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.

• Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.

• Creating roadmaps for some packaging applications and helping to shepherd Applied's product portfolio.

• Lead project across organization and culture in a fast-paced environment

• Self-starter, team player and able to work independently with minimal supervision

Additional Information

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 20% of the Time

Relocation Eligible:
Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

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