R&D Process Engineer (Etch Packaging)

multiple products

• Interact with customers to resolve a wide range of complex process engineering issues/problems with limited to no supervision

• Design and implement new technology, products and analytical instrumentation

• Identify, select and work with vendors and suppliers with limited to no supervision

Requirements:

• PhD or Master or Bachelor in Materials Science, Chemical Engineering, Chemistry or Physics or related field

• Research focus in semiconductor would be an added advantage

• At least 5 years of relevant experiences in semiconductor including Plasma Etch process development field

• Outstanding communication and interpersonal skills

• Problem-solver attitude with determination and quality-mindset

Work Location:

• Science Park II

Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Shift:

Day (Singapore)

Travel:

Not Specified

Relocation Eligible:

No

Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.