ThinkPad Hardware Engineering

Lenovo

2.6

(5)

Yokohama, Japan

#WD00076102

Position summary

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Description and Requirements

Join the Team Driving Innovation at the Heart of ThinkPad Development

Are you ready to shape the future of cutting-edge PC design? Yokohama development team, a leader in ThinkPad product innovation, is seeking a talented Mechanical Engineer to take charge of system integration and thermal design.

Why You Should Apply
You'll play a vital role in designing and developing cooling solutions that ensure superior performance and user experience. Collaborate with experts across ID, ME, and EE teams to deliver world-class ThinkPad products from concept to market, while working with global partners and suppliers.

Your Role

  • Lead mechanical and thermal design for PC systems.

  • Design and evaluate advanced cooling components, including fans, heat sinks, vapor chambers, and graphite sheets using 3D CAD.

  • Collaborate with global teams to optimize system performance, UX, and quality.

  • Oversee supplier management, product execution, and integration with ODM teams.

  • Drive end-to-end development: PoC > NPI > MP > customer feedback > next-gen improvement.

Who You'll Work With
As part of our team, you'll interact with ThinkPad development, NPI, global commodity, and product assurance teams, as well as Lenovo's thermal experts in the USA, Japan, Taiwan, and China.

Make an Impact
This is your chance to contribute to the creation of innovative ThinkPad products, blending technical expertise and creative problem-solving to elevate the user experience.

Additional Locations:

  • Japan - Kanagawa - Yokohama-shi