Advanced Packaging Process Support Engineer

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As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.

About the Role

We are looking for an experienced Process Support Engineer (PSE) to support Applied Materials KINEX bonding equipment in advanced semiconductor packaging environments. This is a customer-facing role focused on die-to-wafer bonding technologies, supporting high-volume manufacturing through hands-on process engineering and on-site technical support.

Key Responsibilities

• Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization

• Support and optimize die-to-wafer bonding processes for advanced packaging applications

• Act as a process owner for Hybrid Bonding technologies, working closely with customer engineering teams

• Design and execute process experiments and DOE, analyze data, and deliver clear technical conclusions

• Resolve complex equipment and process issues using structured root cause analysis

• Collaborate with customers, field service, and internal teams to ensure stable production and yield improvement

• Support small-scale technical projects and continuous process improvements

• Apply best practices and existing solutions to deliver practical, innovative process solutions

Required Qualifications

• Bachelor's degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or related field

• 3-10 years of experience in semiconductor process engineering, equipment support, or advanced packaging

• Strong sense of responsibility, diligence, and ability to perform in physically demanding fab environments

• Strong communication and interpersonal skills

• English proficiency for technical documentation and global collaboration

Preferred Technical Background / Qualifications

• Hybrid Bonding. Die to wafer or wafer to wafer (Fusion bonding)

• Plasma related process/ DRY& WET cleaning experience

• TC& Flip chip bonding process experience

• General backend packaging process experience

Additional:

• Master's degree or PhD in a related field

• Experience with Applied Materials KINEX systems

Why Join Us

• Work with cutting-edge bonding technologies in advanced semiconductor packaging

• High-impact, customer-facing engineering role

• Opportunity to become a subject-matter expert in hybrid bonding processes

• Dynamic, fast-paced fab environment with technical ownership

Additional Information

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:

Relocation Eligible:
No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.