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Job Overview
We are seeking an experienced Metrology Application Engineer to support advanced semiconductor metrology operations, with a focus on thin film thickness and material characterization.
The role will be responsible for tool setup, recipe development, cross-tool matching, and SPC control for state-of-the-art metrology platforms such as:
Rigaku XRF/XRR, Primus system
KLA optical thickness system (SS10K/ASET family)
KLA optical defect inspection system (SP3/SP7)
This position plays a critical role in enabling high-precision metrology capability, process control, and tool-to-tool matching in a fast paced R&D lab environment.
Key Responsibilities
1. Metrology Tool Ownership & Application Development
Own and support thin film metrology tools (XRF/XRR, optical thickness, defect inspection).
Develop, qualify, and release measurement recipes for various material stacks (Cu, dielectric, metal films, etc.).
Ensure measurement accuracy, repeatability, and robustness across process flows.
2. Tool Matching & Correlation
Establish and maintain tool-to-tool matching across identical and dissimilar platforms.
Perform cross-site / cross-tool correlation
Support cross site/lab matching activities to ensure consistent measurement output across tools.
3. Recipe Development & Optimization
Develop and optimize recipes for:
Work closely with process and integration teams to support new film/material introduction and process changes.
Support DOE and characterization plan for new films and stacks.
4. SPC & Process Control
Define and implement SPC strategies for metrology:
Monitor metrology performance and drive continuous improvement initiatives.
Identify and resolve measurement drifts, excursions, and tool-induced variability.
Cross-functional Collaboration
Work closely with:
Support training and knowledge transfer for technicians and engineers.
Qualifications & Requirements
Education
Bachelor's degree in:
Materials Engineering
Physics/Chemistry
Electrical Engineering or Semiconductor-related discipline
Experience
3-5+ years of experience in semiconductor metrology / process engineering
Hands-on experience with:
XRF / XRR (Rigaku or equivalent)
Optical thickness tools (KLA SS10K / ASET etc)
Tool matching and correlation
Recipe development and optimization
SPC implementation and monitoring
Technical Skills
Strong understanding of:
Thin film physics (density, roughness, composition)
Measurement principles (X-ray, reflectometry, optical)
Familiar with DOE and data analysis
Ability to troubleshoot measurement discrepancies and tool drift issue.
Soft Skills
Strong analytical and problem-solving skills
Fast leaner & ability to work in a fast-paced R&D lab environment
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Not Specified
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.