Intern (Infrastructure)

Date posted 11/04/2026
Category Interns/Temp Hire Type Intern Job ID 19552 Remote Eligible No Date Posted 11/04/2026

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You are a mechanical or materials engineering student who gets excited when simulation results actually match physical behavior. You have spent enough time in Ansys Mechanical to know that a converged solution is not the same as a correct one, and you ask the questions that close that gap. Maybe you used it in a capstone project modeling thermal stress in packaging, or you ran nonlinear contact simulations for a research lab. Either way, you know your way around element types, mesh refinement, and boundary conditions without needing a tutorial open in another window.

You are curious about what happens inside a chip during fabrication. Thermal cycling, material interfaces, deformation under processing conditions, these are not abstract concepts to you. You want to understand why things fail and how to predict it before they do. You are comfortable working through a problem that does not have a clear answer yet, tweaking parameters, reviewing results, and iterating until the model makes sense. At Synopsys, you will work on real semiconductor process challenges alongside engineers who build the tools the industry depends on.

What You'll Be Doing

• Build and run Ansys Mechanical models that simulate semiconductor manufacturing processes like deposition, etching, bonding, and thermal cycling
• Perform structural and thermal-mechanical analyses to investigate stress, deformation, heat transfer, and failure modes in semiconductor devices and packaging
• Evaluate simulation results for accuracy and physical relevance, troubleshooting convergence issues and refining meshes and material models as needed
• Support the development of reusable simulation workflows and templates that can be applied across different process scenarios
• Document your setup, assumptions, results, and findings in technical reports that help the team understand what works and what needs refinement
• Collaborate with engineers and researchers to align simulation objectives with real-world process challenges

The Impact You Will Have

• Your models will help predict and prevent failures in semiconductor manufacturing before they reach the fab
• The workflows you develop will accelerate future simulation work, making it faster for the team to explore new materials and process conditions
• Your analysis will contribute to understanding how thermal and mechanical stresses affect chip reliability and yield
• The documentation you create will serve as a reference for future interns and engineers working on similar problems
• Your work will support the development of simulation capabilities that Synopsys and its customers use to design better, more reliable semiconductors
• You will help bridge the gap between academic FEA knowledge and industrial semiconductor process simulation

What You'll Need

• Currently enrolled as a 3rd-year undergraduate or above in Mechanical Engineering, Materials Science & Engineering, or a closely related field
• Hands-on experience using Ansys Mechanical for structural or thermal analysis, not just coursework but actual project work where you owned the setup and results
• Experience applying Ansys Mechanical to semiconductor-related problems, whether in a class project, research lab, or internship
• Solid understanding of finite element analysis fundamentals, including structural mechanics, heat transfer, and material behavior
• Basic familiarity with semiconductor manufacturing processes is a plus, even if it is from coursework or reading
• Experience with thermal-mechanical coupling, nonlinear analysis, fracture mechanics, or delamination modeling is a plus
• APDL scripting or Python experience for automating Ansys workflows is a plus

Who You Are

• You can look at a simulation result that seems off and figure out whether it is a mesh problem, a boundary condition problem, or a material model problem
• You do not just run simulations, you think about what the physics should look like and whether your setup is actually capturing it
• You are comfortable asking for clarification when a problem statement is vague, and you can work independently once you understand the goal
• You document your work clearly enough that someone else can pick up your model and understand what you did and why
• You are genuinely interested in how things break and how to predict it, not just in getting a result that looks good

The Team You'll Be Part Of

Your recruiter will share more about the team structure and mission during the interview process.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.