27 jobs for "IC Package Design Engineer"

IC Packaging Engineer

At Apple - 台北

Posted on Oct 7

View job Apply on company site

Packaging Assembly Engineer

At Apple - 서울

Posted on Sep 27

View job Apply on company site

IC Packaging Engineer

At Apple

Posted on Sep 24

View job Apply on company site

Packaging Assembly Engineer

At Apple - Seoul

Posted on Aug 4

View job Apply on company site

IC Package Integration Lead

At Apple - Austin Metro Area

Posted on Oct 15

View job Apply on company site

Packaging Assembly Engineer

At Apple - Austin Metro Area

Posted on Oct 9

View job Apply on company site

Packaging Assembly Engineer

At Apple - Austin Metro Area

Posted on Oct 9

View job Apply on company site

Apple

Packaging Assembly Engineer

Austin Metro Area, TX$175,000 – $308,500Posted Oct 9, 2026

Apply on company site View full job

Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity

Ratings are based on anonymous reviews by Fairygodboss members. See all reviews ›

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.

Description

Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.","responsibilities":"Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).

Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.

Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings.

Lead root-cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams.

Partner with substrate and package design teams to provide DFM input on pad/bump design, stack-up, warpage control, and assembly design rules for FCBGA packages.

Support NPI builds and ramp at OSAT sites: process window definition, buy-off criteria, and transfer to volume manufacturing.

Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets.

Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly.

Preferred Qualifications

M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.

5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis

Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.

Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.

Ability to work independently and take on projects with minimum supervision.

Good engineering problem solving skills with strong engineering physics and fundamentals.

Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging.

Good program management skill

Minimum Qualifications

BS and 10+ years of experience in relevant industry experience or equivalent

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,000 and $308,500, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

View company profile