SoC Packaging Engineer
May 28, 2026 台北
About us
Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.
- Size: 10,000+ employees
- Industry: Technology: Manufacturing
Why you should apply for a job to Apple:
Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity
Ratings are based on anonymous reviews by Fairygodboss members. See all reviews ›
At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?
Description
We are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.","responsibilities":"Evaluate leading edge Photonic packaging technologies including characterization and improvement to Silicon Photonic performance, yield and reliability. Define package characteristics and specification, and solve device & yield issues from NPI to mass production.
Work with leading foundry, design house, assembly and optical suppliers on Co-package optics development from design, new material, new equipment selection and establish robust process of record. Perform initial proof of concept sample build, test vehicle validation, package and process qualification, yield and continuous improvement.
Interface and coordinate with other packaging team members to comply with product development & ramp schedule. Deliver product milestones on time.
Define packaging roadmap based on long term package product requirements. Work closely with suppliers and manage R&D activities.
At least 5~10% travel to domestic and international locations.
Preferred Qualifications
Good understanding to optics and photonics fundamentals, device/module integration.
Knowledge in Optical device laser, modulator, photo detector, passive components is a plus.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
Minimum Qualifications
M.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing, data center and SiPH (silicon photonics) applications.
In-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber) and MCM module assembly.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?
Description
We are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.","responsibilities":"Evaluate leading edge Photonic packaging technologies including characterization and improvement to Silicon Photonic performance, yield and reliability. Define package characteristics and specification, and solve device & yield issues from NPI to mass production.
Work with leading foundry, design house, assembly and optical suppliers on Co-package optics development from design, new material, new equipment selection and establish robust process of record. Perform initial proof of concept sample build, test vehicle validation, package and process qualification, yield and continuous improvement.
Interface and coordinate with other packaging team members to comply with product development & ramp schedule. Deliver product milestones on time.
Define packaging roadmap based on long term package product requirements. Work closely with suppliers and manage R&D activities.
At least 5~10% travel to domestic and international locations.
Preferred Qualifications
Good understanding to optics and photonics fundamentals, device/module integration.
Knowledge in Optical device laser, modulator, photo detector, passive components is a plus.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
Minimum Qualifications
M.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing, data center and SiPH (silicon photonics) applications.
In-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber) and MCM module assembly.
Additional Information
- Posted: May 28, 2026