3 jobs for "ICT Engineer"

ICT Engineer

At Leidos - Melbourne

Posted on Oct 15

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ICT Engineer

At Leidos - Adelaide

Posted on Oct 15

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Design for Manufacturing (DFM) Engineer - PCBA

At Apple - Bengaluru

Posted on Oct 16

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Apple

Design for Manufacturing (DFM) Engineer - PCBA

Bengaluru, IndiaPosted 24 days ago

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Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity

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Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.

The people here at Apple don't just create products - they create the kind of wonder that's revolutionized entire industries. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.

Apple products are as beautiful on the inside as they are on the outside. Inside every one of our products, are some of the world's most challenging consumer PCBA and Flex designs. Imagine yourself as a select member of the team that brings these assemblies from concept to high volume manufacturing.

Description
In this highly visible role, you will have the opportunity to make a significant impact on Apple Products, and leave a footprint for years to come. We have an opportunity for an accomplished PCBA DFM engineer to lead the development, and ramp for a next generation Apple product.

Our PCBA DFM engineering team enables the mass creation of impossible products as a partner in the development of Apple's renowned designs.","responsibilities":"Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI)
Provide guidance and resources to contract manufacturing (CM) partner engineers
Act as project leader on a variety of complex projects
Plan, develop and implement technically complex procedures for PCBA manufacturing process, rework, and testing
Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements
Design and develop technically complex new processes to improve quality and efficiency
Provide early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging.
Interface with Apple Printed Circuit Board Assembly (PCBA) Subcontractor and manage technical aspects of Volume Manufacturing builds including rework processes, with direction as necessary from Operations Engineering DRI
Ensure Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites

Preferred Qualifications
Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
Experience with the development and evaluation of various SMT processes
Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
Good team player with an ability to work with multiple x-functional teams

Minimum Qualifications
BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
5+ years of experience in printed circuit assembly manufacturing processes.
Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
Travel domestically and internationally to supplier sites - 60%

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

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