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Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.

Description

In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple's future products.

You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.

Your ownership will span the entire product lifecycle, from initial concept through qualification.","responsibilities":"Determine the direction of next-generation package architecture by evaluating available and emerging packaging technologies.

Collaborate with cross-functional teams to solve integration challenges, including electrical, mechanical, and thermal.

Drive vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and reliability.

Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM).

Drive memory vendors to develop package materials and technology for leading-edge package design rules.

Preferred Qualifications

MS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.

Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.

Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.

Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.

Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.

Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.

Excellent communication skills for collaborating with internal teams and managing external vendors.

Minimum Qualifications

BS and 10+ years of relevant industry experience

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

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