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Apple

Digital ASIC Architect

San Francisco Bay Area, CA$175,000 – $308,500Posted 29 days ago

Apply on company site View full job

Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
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3.1/5 in supportive management
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65% would recommend this company to other women
66% say the CEO supports gender diversity

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Define the digital architecture behind Apple's next generation of motion-aware experiences. The Motion Sensing Hardware organization designs the IMUs, magnetometers, pressure sensors, and other sensing ASICs that enable spatial computing, gesture input, head-tracked audio, and crash and fall detection across iPhone, iPad, Apple Watch, AirPods, and Vision Pro. The architectures and hardware our team invents are what become the features customers feel first. If you want to set the direction for what motion sensing on Apple products can do, this is your team.

Description

As a Digital ASIC Architect on the Motion Sensing Hardware team, you will own the digital architecture of motion sensing ASICs from concept through silicon, with the goal of delivering best-in-class sensing experiences across Apple's product line. You will analyze the application, then define cost and power optimized digital systems built around one or more processors, DSP cores, and custom control engines. You will translate high-level user and product requirements into a realizable system, build the high-level models that prove out the architecture, and author the detailed specifications that drive the rest of the IC development. This is a highly cross-functional role. You will work with circuit design, firmware, algorithms, software, and product teams to identify the critical interactions between the ASIC and the broader product, and you will produce the architectures and specifications that become the silicon Apple ships and the features customers feel.","responsibilities":"Define the digital architecture needed to achieve the module ERS, including evaluation and down-selection of processor, DSP, memory, and interface IP and topologies against performance/power/area/risk

Perform trade-off analysis and interface with the Analog ASIC Architect, MEMS Architect, Firmware Lead, and SoC team for system-level architectural decision making

Define hardware/firmware partitioning, memory hierarchy, bus topology, clock and power domain structure, and peripheral integration

Lead digital architecture reviews with vendor and internal stakeholders

Develop sensing algorithms and signal processing pipelines, and build high-level models in MATLAB, Python, or SystemC to predict performance before RTL exists

Co-simulate digital with a behavioral analog front-end and MEMS model to validate full system interaction, then correlate models against first silicon to close the loop for the next iteration

Author IP-level and IC-level specifications that anchor design, verification, and characterization, including:

Processor, DSP, memory, bus, and custom control-engine requirements

Clocking, reset, power management, and I/O / peripheral specs

Host SoC and sensor AFE interface definitions

Drive defect root cause analysis and resolution from bring-up through mass production

Document architectural assumptions, open items, known risks, and waiver justifications for tape-out readiness sign-off

Communicate program status, technical issues, risks, and mitigation plans clearly and concisely

Minimal business travel as needed to support product development

Preferred Qualifications

Deep expertise in digital ASIC architecture for sensor or mixed-signal systems, including processor and DSP sub-system definition, memory and bus architecture, and custom control engine micro-architecture

Proven track record of defining and taping out high-volume, complex digital and mixed-signal ICs from architecture through production

Strong foundation in system-level design, requirements development, and hardware/firmware partitioning for sensing or low-power embedded applications

Experience developing sensing algorithms and signal processing pipelines, with the modeling skills to evaluate them before silicon

Experience with IC bring-up, silicon characterization, and system-level debug

Proficiency in MATLAB, Python, C/C++, or SystemC for high-level modeling and simulation

Minimum Qualifications

BS in Electrical Engineering or related field with a minimum of 10 years of relevant industry experience

Excellent written and verbal communication skills

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,000 and $308,500, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

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