48 jobs for "IC Packaging Engineer"

Silicon Photonics EPM, Data Center SoC

At Apple - Cupertino

Posted on Oct 14

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Haptic Module Process Engineer

At Apple

Posted on Oct 12

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Silicon Photonics EPM, Data Center SoC

At Apple - Cupertino

Posted on Oct 14

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Principle Applications Engineer, 3DIC SI PI

At Ansys - Sunnyvale

Posted on Oct 22

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Lead Product Validation Engineer - SI/PI

At Cadence Design Systems - Shanghai

Posted on Aug 5

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Lead Product Validation Engineer

At Cadence Design Systems - Shanghai

Posted on Nov 6

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Experienced Analog Design Engineer (m/f/d)

At Apple - München

Posted on Oct 7

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Analog Design Engineer - SERDES

At Apple - Dublin

Posted on Oct 6

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Apple

Silicon Photonics EPM, Data Center SoC

Cupertino, CA$175,500 – $311,700Posted 24 days ago

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Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs, unlocking the bandwidth, energy efficiency, and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help shape how Apple's silicon connects at the speed of light. Are you a hard-working and proactive engineering leader with a curiosity about optics, photonics, and the future of high-bandwidth silicon interconnects? We are absolutely seeking you out!

Description

Apple is seeking an experienced Engineering Program Manager to lead Analog, Mixed-Signal, and Silicon Photonics IP programs within our silicon organization, with a focus on data center SoCs. In this role, you will drive the end-to-end development of high-speed AMS and optical IPs, including SerDes, PLLs, Data Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O subsystems, from early concept through mass production, ensuring quality, schedule, and successful delivery across our SoC portfolio.

You will bring deep familiarity with advanced packaging technologies (including 2.5D/3D near and co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS IP development flows and methodologies in an SoC environment. You will serve as the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV, Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and Legal - defining test structure requirements, establishing robust electrical and optical testing methodologies, and ensuring all technical and compliance gates are met on schedule.

Your ability to distill complex electro-optical technical information into clear communication, identify risks across a multi-disciplinary supply chain (foundries, OSATs, laser and optical component vendors), develop mitigation strategies, and align diverse cross-functional stakeholders will be critical to delivering on aggressive hardware milestones for data center silicon.","responsibilities":"Drive Silicon, Photonics & Packaging Execution: Manage the program lifecycle for complex Mixed-Signal IP, Silicon Photonics engines, and optical I/O subsystems within data center SoC designs, ensuring alignment from concept to tape-out to HVM.

Lead Optical I/O & Co-Packaged Optics Programs: Orchestrate development of optical engine modules, fiber array/connector integration, and co-packaged optics (CPO) solutions in partnership with photonics design, packaging, and assembly teams.

Collaborate on Proprietary Tech: Partner closely with foundational vendors, silicon and photonics foundries, OSATs, and laser / optical component suppliers to co-develop proprietary hardware solutions tailored for next-generation data center products.

Define Electrical & Optical Testing Frameworks: Collaborate with engineering teams to define requirements for advanced electrical and optical test structures (loopback, BER, optical coupling, wavelength, thermal) and implement robust characterization and qualification strategies.

Orchestrate Cross-Functional Teams: Act as the central hub connecting IC Design, Photonics Design, SI/PI, Optical Packaging, Reliability, Operations, Tooling, and Legal to ensure all program dependencies, compliance, and technical gates are met.

Global Program Management: Lead and synchronize global engineering efforts, effectively managing communication and deliverables across multiple international time zones and a geographically distributed photonics ecosystem.

Navigate Ambiguity in an Emerging Domain: Maintain high agility and execution velocity in the rapidly evolving SiPh and optical I/O landscape, adapting schedules and strategies as project requirements, standards, and technologies pivot.

Preferred Qualifications

MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field.

Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications.

Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.

Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages.

Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale.

Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives.

Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain.

Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms.

History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability.

Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.

Minimum Qualifications

BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience.

Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,500 and $311,700, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

About Apple

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Industry: Technology: Manufacturing

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