Lead Customer Engagement Engineer - Voltus
Jul 23, 2026 Shanghai, China
About us
Cadence is a pivotal leader in computational software.
- Size: 10,000+ employees
- Industry: Technology: Manufacturing
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At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Role Focus
This role primarily supports Foundry PDK teams and Design Service teams by enabling EM/IR and thermal signoff technologies through robust techfile development and reference flow creation.
Key Responsibilities - Foundry PDK Support
• Support foundry PDK teams in development and validation of EM/IR and Thermal techfiles for Voltus and Celsius.
• Define and validate power integrity, EM, and thermal modeling assumptions aligned with foundry signoff requirements.
• Collaborate with PDK, extraction, and signoff teams to ensure tool readiness for advanced-node and 3DIC processes.
Key Responsibilities - Design Service Support
• Develop and maintain design reference flows for EM/IR and thermal signoff used by design service teams.
• Support hierarchical and full-chip signoff flows from early design stages to tape-out.
• Provide flow debugging and convergence support for large SoC and multi-die designs.
Technical Scope
• Static/Dynamic IR drop and EM signoff using Voltus.
• Electro-thermal co-analysis using Voltus and Celsius.
• Advanced-node, chiplet, and 3DIC thermal analysis.
Required Skills
• Strong understanding of EM/IR and thermal fundamentals.
• Experience with UNIX/Linux environments and Tcl/Python scripting.
• Familiarity with digital backend and signoff flows.
We're doing work that matters. Help us solve what others can't.
Role Focus
This role primarily supports Foundry PDK teams and Design Service teams by enabling EM/IR and thermal signoff technologies through robust techfile development and reference flow creation.
Key Responsibilities - Foundry PDK Support
• Support foundry PDK teams in development and validation of EM/IR and Thermal techfiles for Voltus and Celsius.
• Define and validate power integrity, EM, and thermal modeling assumptions aligned with foundry signoff requirements.
• Collaborate with PDK, extraction, and signoff teams to ensure tool readiness for advanced-node and 3DIC processes.
Key Responsibilities - Design Service Support
• Develop and maintain design reference flows for EM/IR and thermal signoff used by design service teams.
• Support hierarchical and full-chip signoff flows from early design stages to tape-out.
• Provide flow debugging and convergence support for large SoC and multi-die designs.
Technical Scope
• Static/Dynamic IR drop and EM signoff using Voltus.
• Electro-thermal co-analysis using Voltus and Celsius.
• Advanced-node, chiplet, and 3DIC thermal analysis.
Required Skills
• Strong understanding of EM/IR and thermal fundamentals.
• Experience with UNIX/Linux environments and Tcl/Python scripting.
• Familiarity with digital backend and signoff flows.
We're doing work that matters. Help us solve what others can't.
Additional Information
- Posted: Jul 23, 2026
