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Apple

Product Design Engineer - SiP NPI

Posted 25 days ago

Apply on company site View full job

Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity

Ratings are based on anonymous reviews by Fairygodboss members. See all reviews ›

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Here, you'll do more than join something - you'll define something.

As one of us (SiP process NPI team), you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.

Description
As a SiP NPI engineer, you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase , prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, you will be the key stakeholder to lead OSAT's process team for process development & qualification per projects assigned.You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function teams.

","responsibilities":"Collaborate with x-function team, to define next-gen SiP architecture based on assessment of functionality / form factor / process capability

Define general process flow and assess process risk per different options, co-work with internal RD team or OSAT team for early validation to de-risk and update risk level based on validation result

Work with internal project management team, to define NPI timeline, detailed bring up plan, formal build plan, post build plan and etc

Take lead for process development in POC build & NPI build, drive OSAT process team to bring up each process steps (material down-selection, equipment qualification, tooling design, recipes fine tune) , integrate as one robust process flow and deliver SiP with timely manner (based on NPI build plan) & high quality (yield, reliability)

Work with EE team & REL team for process related FA, take lead of process trouble shooting, commonality study, corrective actions and drive till closure.

Drive OSAT team, material vendor, equipment vendor for potential process yield improvement, cost reduction, design rule improvement.

~ 20% domestic / international travel

Preferred Qualifications
Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing

Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages

Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP)

Ability to work under pressure with a wide range of people with varying degrees of experience

Familiar with quality tools, including SPC, Cpk, DOE, data distribution, data correlation, commonality study and etc

Excellent communication skills with both Mandarin & English

Minimum Qualifications
M.S degree in mechanical engineering, physics, materials science or equivalent, with a minimum of 3 years of experience in IC packaging (for Bachelor, minimum 5 years experience is required)

General knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

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