2,817 jobs for "Lead Solutions Engineer"

Packaging Assembly Engineer

At Apple - 서울

Posted on Sep 27

View job Apply on company site

Senior Engineer, Automation Controls, Air Manufacturing Innovation

At Nike - Beaverton

Posted on Sep 26

View job Apply on company site

Principal Applied AI App Engineer

At Mastercard - Pune

Posted on Jul 21

View job Apply on company site

Lead Software Engineer, ITC

At Nike

Posted on Aug 13

View job Apply on company site

Principal Site Reliability Engineer (Cloud, Observability & Automation)

At DTCC - Jersey City

Posted on Oct 28

View job Apply on company site

Principal Engineer

At Aristocrat - Las Vegas

Posted on Oct 22

View job Apply on company site

IND IT Software Engineer I

At Alight Solutions - Gurgaon

Posted on Sep 7

View job Apply on company site

Head of Operations Analytics

At Adyen - Amsterdam

Posted on Sep 30

View job Apply on company site

Senior Software Engineer

At Mastercard - O'Fallon

Posted on Nov 5

View job Apply on company site

Principal Machine Learning Engineer, ITC

At Nike

Posted on Nov 3

View job Apply on company site

Staff Engineer - Customer Onboarding

At Adyen - Chicago

Posted on Nov 3

View job Apply on company site

Principal Technical Engineer - Identity Access Management

At Cummins

Posted on Nov 2

View job Apply on company site

Principal Engineer II — Data Engineering

At Toyota North America - Plano

Posted on Oct 31

View job Apply on company site

Senior Manager, Full-Stack Engineer (People Leader)

At Capital One - McLean · Richmond

Posted on Oct 23

View job Apply on company site

Senior Software engineer

At Mastercard - O'Fallon

Posted on Oct 14

View job Apply on company site

Electrical Engineer - Microgrid Systems

At Leidos - Remote / Flexible

Posted on Oct 8

View job Apply on company site

Senior Implementation Engineer

At Adyen - Toronto

Posted on Sep 29

View job Apply on company site

Front-end Engineer 4

At Capital One - New York · McLean

Posted on Sep 27

View job Apply on company site

Senior Implementation Engineer

At Adyen - London

Posted on Sep 12

View job Apply on company site

Senior Principal Anaplan Software Engineer

At Nike - Beaverton

Posted on Aug 4

View job Apply on company site

Apple

Packaging Assembly Engineer

서울Posted Sep 27, 2026

Apply on company site View full job

Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity

Ratings are based on anonymous reviews by Fairygodboss members. See all reviews ›

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.
Packaging Assembly Engineer

설명
Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.","responsibilities":"Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings.
Lead root-cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams.
Partner with substrate and package design teams to provide DFM input on pad/bump design, stack-up, warpage control, and assembly design rules for FCBGA packages.
Support NPI builds and ramp at OSAT sites: process window definition, buy-off criteria, and transfer to volume manufacturing.
Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets.
Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly.

선호 자격 요건
None

최소 자격 요건
5+ years of extensive experience in Semiconductor Packaging field.
Working knowledge in materials characterization and analysis.
Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
Ability to work independently and take on projects with minimum supervision.
Good engineering problem solving skills with strong engineering physics and fundamentals.
Can use package design softwares, APD, Virtuoso, etc.
Working knowledge in memory packaging.
Good program management skill.
M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field desired.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

View company profile