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Product Design Engineer - SiP NPI

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Posted on Oct 17

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Product Design Engineer - DFM SiP / PCBA NPI

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Engineering Project Manager Intern - Shanghai or Shenzhen

At Apple

Posted on Oct 16

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Apple

Product Design Engineer - DFM SiP / PCBA NPI

Bengaluru, IndiaPosted 23 days ago

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Why you should apply for a job to Apple:

Ranked as one of the Best Technology Companies in 2020
3.7/5 in overall job satisfaction
3.1/5 in supportive management
66% say women are treated fairly and equally to men
65% would recommend this company to other women
66% say the CEO supports gender diversity

Ratings are based on anonymous reviews by Fairygodboss members. See all reviews ›

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Here, you'll do more than join something - you'll define something.

As a part of SiP process NPI team, you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.

Description
As a DFM SiP/ PCBA NPI engineer, you will play a crucial role in developing next generation SiP process and PCBA assembly process for various of end products. You will be deeply involved from early design phase , prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, you will be the key stakeholder to lead OSAT's process team for process development & qualification per projects assigned.This role partners closely with cross-functional engineering teams, suppliers, and factory operations to support NPI, equipment development, and high-volume manufacturing while meeting quality, cost, and delivery objectives.","responsibilities":"Collaborate with cross functional teams, to define next-gen SiP architecture based on assessment of functionality / form factor / process capability
Define general process flow and assess process risk per different options, co-work with internal RD team or OSAT team for early validation to de-risk and update risk level based on validation result
Work with internal project management team, to define NPI timeline, detailed bring up plan, formal build plan, post build plan and etc.
Take lead for process development in POC build & NPI build, drive OSAT process team to bring up each process steps (material down-selection, equipment qualification, tooling design, recipes fine tune), integrate as one robust process flow and deliver SiP with timely manner (based on NPI build plan) & high quality (yield, reliability)
Work with EE team & REL team for process related FA, take lead of process trouble shooting, commonality study, corrective actions and drive till closure
Drive OSAT team, material vendor, equipment vendor for potential process yield improvement, cost reduction, design rule improvement

Preferred Qualifications
Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing
Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages
Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP)
Ability to work under pressure with a wide range of people with varying degrees of experience
Familiar with quality tools, including SPC, Cpk, data distribution, data correlation, commonality study and etc
Excellent communication skills in English

Minimum Qualifications
Bachelors or Masters degree in Mechanical engineering, Physics, Materials Science or equivalent
5 years of experience in IC packaging / Surface Mount Technology / Printed Circuit board assembly process
Solid knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials
Strong knowledge of SMT Processes, mechanical design, GD&T, Tolerance Analysis

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology: Manufacturing

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